Micro-electronics/Test Engineer

Job Description

At Capgemini engineering we value excellence, care, responsibility, dynamism and innovation. We offer a job with variation that leaves plenty of room for initiative and development. In fact, we are not just offering you a job, we’re inviting you to be part of our community where we will provide you trainings, tools & grounds for professional and personal growth. Each career experience is assorted by an attractive salary package.

Our offer :

• A unique opportunity to join an international and collaborative company;

• Insurances, a mobility plan of your choice and other benefits;

• Integration in a solid and dynamic team;

• Participation in exciting and motivating infrastructure projects;

• Career evolution;

• Training possibilities and official certification within our Capgemini Engineering Academy

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Your role:

• Applying your knowledge and skills in an innovative engineering role.

• Working on hi-tech products in the Micro-Electronics domain.

• Be involved in developing new IC package as well as cost down activities for SoC devices, from feasibility study and package choice to assembly.

• Working in close interaction with foundries’ Physical design Engineers, substrate & System PCB designers, SoC & System architects

• Developing a DFT (Design For Test) strategy in collaboration with design engineers during the design stage, including planning how to integrate DFT features such as scan chains, built-in self-test (BIST), and boundary scan into the ASIC design.

• Designing and developing test plans and test programs for ASICs (creating test vectors, writing test scripts, and developing methodologies to test different aspects of the ASIC's functionality).

• Using DFT to maximize test coverage and ensure that all parts of the ASIC are adequately tested.

• Analyzing test results and identifying root causes of failures. This can involve working closely with design and test teams to understand and resolve issues.

• Analyzing production data to identify trends and causes of yield loss. Implementing solutions to improve yield and ensure that more chips pass testing.

• Ensuring that all testing adheres to industry standards and regulatory requirements, and that the products meet quality and safety standards.

• Continuously seeking ways to improve test methods and processes to increase efficiency, reduce costs, and improve product quality

Your profile and skills:

• Master’s degree in Electronics or Electrical engineering or Micro-Electronics

• Relevant experience in the field of analog and/or mixed signal

• Good understanding of Integrated Circuit packaging technology & applications

• Knowledge in IC design a plus

• Knowledge in chip packaging, assembly, chip test solutions, is a plus

• Experience with Electronics CAD systems (OrCAD, Cadence, Eagle, etc.)

• Excellent verbal and written skills

• Excellent analytical and problem solving skills

• Fluency in English mandatory; Fluency in Dutch and/or French desirable.

If you are a team player, if you recognize yourself in the following profile and are not afraid of taking on challenges… Apply today!